SMT is the abbreviation of Surface Mounted Technology, which is currently the most popular technology and process in the electronics assembly industry. SMT machines refer to machines and equipment used in SMT processing. The most basic equipment includes: automatic printing machine, placement machine, and multi-temperature zone reflow soldering.
The internal circuit boards of all kinds of digital home appliances and other electronic products that are common in our daily life are realized by this technology. The electronic components are mounted on the circuit light board through the placement machine in the smt device, and then the Reflow Oven is soldered. Eventually becoming a motherboard, smt plays a huge role in today's electronics industry.
The main advantages of SMT over the older through-hole technique are:
Much higher component density (components per unit area) and many more connections per component.
Higher density of connections because holes do not block routing space on inner or back-side layers.
Components can be placed on both sides of the circuit board.
Small errors in component placement are corrected automatically as the surface tension of molten solder pulls components into alignment with solder pads.
Better mechanical performance under shake and vibration conditions.
Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.
Fewer holes need to be drilled.
Lower initial cost and time of setting up for production.
Simpler and faster automated assembly. Some placement machines are capable of placing more than 136,000 components per hour.
Many SMT parts cost less than equivalent through-hole parts.
A surface mount package is favored where a low profile package is required or the space available to mount the package is limited. As electronic devices become more complex and available space is reduced, the desirability of a surface mount package increases. Concurrently, as the device complexity increases, the heat generated by operation increases. If the heat is not removed, the temperature of the device rises shortening the operational life. It is therefore highly desirable to develop surface mount packages having high thermal conductivity.
Better EMC performance (lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the smaller lead inductance.
